Electrical design · PCB assembly

From schematic to an assembled board, without the hand-off.

Schematic capture, PCB layout, and design for manufacturing are done in McKinney, Texas. Assembly runs at our facility in India from the same released files and BOM. The engineers who drew the board are the ones who bring it up.

Equipment and specs
PICK · PLACE · INSPECT

Electrical design · McKinney, Texas

Boards drawn with the line and the firmware in view.

Every schematic is reviewed with the firmware plan beside it, and every layout is checked against the assembly process that will build it.

Schematic design

Part selection, power trees, interfaces, and protection, drawn with the firmware requirements open next to them.

  • Power
  • Interfaces
  • Protection

PCB layout

Stack-up planning, controlled-impedance routing, power and signal integrity, and EMC-aware placement.

  • Stack-up
  • Controlled impedance
  • EMC

MCU and radio integration

Crystal, decoupling, debug header, and antenna handled with reference-design care, so bring-up starts from a board that boots.

  • STM32
  • nRF
  • Antenna

Design for manufacturing

DFM and DFT review against the line that will build the board: footprints, fiducials, panelization, and test points.

  • DFM
  • DFT
  • Panelization

PCB assembly · Vadodara, India

Assembly at our own facility.

The assembly team works from the released revision and the same BOM as engineering, and builds go back to McKinney for bring-up and test. ISO 9001:2015 quality system, IPC-A-610 and J-STD-001 trained staff.

SMT assembly

Surface mount, through-hole, and mixed technology, run from the released Gerbers, pick-and-place file, and BOM. Selective and wave soldering for the through-hole side.

  • SMT
  • Through-hole
  • Selective and wave

IPC trained, ISO 9001 facility

Operators trained to IPC-A-610 and J-STD-001, working under an ISO 9001:2015 quality system. Every board is inspected with 3D SPI, 3D AOI, and X-ray before it ships.

  • IPC-A-610
  • J-STD-001
  • ISO 9001:2015

Prototype and NPI

First articles and small runs, with what the line learns going straight into the next revision.

  • First article
  • Small batch
  • NPI

Repeat builds

Production runs of a released design, with BOM sourcing and change control shared with the engineering team.

  • Repeat builds
  • BOM sourcing
  • Change control

Equipment and specs

The line, from paste to reflow.

Paste, placement, reflow, and inspection on one line, with selective and wave soldering for through-hole parts and conformal coating and box build after.

01 SOLDER PASTE02 PICK AND PLACE03 REFLOWfeederASSEMBLY LINE · INDIAbare board → paste → place → reflow
Placement rate
Up to 90,000 components per hour
Component range
01005 passives to micro BGA, QFN, CSP, LCC
Inspection
3D SPI, 3D AOI, X-ray
Soldering
Reflow, selective, and wave
After assembly
Conformal coating, box build, cable harness, functional test
Board size and pitch
Confirmed against the line for your design during DFM review

Photos of the assembly line will replace the animation once available.

Discuss your board

Send the schematic or Gerbers and the BOM. We will review them for manufacturability and tell you what the first build would involve.

Start a project